OpenAI’s Phone Edges Closer, Likely Powered by Dimensity Processor
A fresh update from analyst Ming-Chi Kuo suggests that OpenAI is moving faster than expected on its first AI-focused smartphone. Earlier reports pointed to a 2028 launch. However, the latest information shows the company may bring the device to market sooner.
Kuo now believes mass production could begin in the first half of 2027. He links this shift to the rapid growth of AI smartphones. At the same time, a possible year-end IPO could also be pushing the timeline forward.
The report also reveals early hardware details. Kuo says MediaTek will likely act as the sole SoC supplier. The phone is expected to feature a customized Dimensity 9600 chipset. This chip will use TSMC’s N2P process, which is planned for the second half of this year.
Imaging will play a key role in the device. Kuo notes that the ISP may include an improved HDR pipeline. As a result, the phone could deliver better real-world visual sensing and image quality.
The device will also focus heavily on AI performance. It is expected to include a dual-NPU architecture to handle advanced AI tasks. In addition, the phone may come with LPDDR6 RAM and UFS 5.0 storage, ensuring faster data processing and smooth performance.
Security features are also part of the plan. The smartphone is expected to support pKVM and inline hashing. These technologies should help improve system protection and data integrity.
If development continues without delays, Kuo reports estimated strong shipment numbers. Total shipments in 2027 and 2028 could reach 30 million units. This figure highlights the company’s ambition to compete in the growing AI smartphone market.




